【推荐】英文学术会议邀请函4篇
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英文学术会议邀请函 篇1
Dear Colleagues,
It is a great pleasure to invite you to the XXth International Conference on Composite Materials (ICCMXX), which will be held from July 28 to August 2, 20xx in Montreal, Canada. This conference is one of the most highly acclaimed meetings in the field of composite materials and it takes place biannually in different countries all over the world. Most recently, the conference was held in Edinburgh, UK (20xx) and Jeju, Korea (20xx). We are truly glad to host such a prestigious event in the beautiful city of Montreal.
This time, the organizing committee has chosen "Composite Materials: The Great Advance" as the main theme for the conference, with a focus on the latest developments and trends, as well as future outlook of the field of composite materials and structures. The conference program includes plenary lectures, oral and poster presentations, exhibitions, and various social programs for over 1,000 participants from around the world.
Abstract submissions have now begun. On behalf of ICCMXX, we extend an invitation to you to submit an abstract(s) for oral and/or poster presentations. The deadline for submissions is December 15, 20xx. Abstracts are submitted online in Confsys (our online submission management system). Authors must complete the sign in process (including profile and interests) before being able to submit. You will find full instructions and abstract template at http://iccmXX.org/abstract_submit.htm.
Abstracts will be peer-reviewed by the scientific program committee from December 27, 20xx to February 22, 20xx. Notification of Acceptance will be provided by email to the Author(s) by February 28, 20xx. A presenter for each accepted abstract must then register with full payment and accept copyright clearance before the full paper upload will be accepted.
We thank you for your consideration and look forward to hearing from you. Should you have any questions, please contact ICCMXX Secretariat at iccm@iccmXX.org.Sincerely,
Suong V. Hoa, General Chair
Pascal Hubert, Technical Program Chair
ICCMXX Secretariat 1455 De Maisonneuve West, Ev4-145 Montreal, Quebec, Canada H3G 1M8 Tel: 514-848-2424 x7997 Fax: 514-848-45XX
February 9, 20xx
英文学术会议邀请函 篇2
dear ms wang:
i have the great pleasure, on behalf of the international conference onmedical biometrics orga
nization, of inviting you to contribute to the symposiumon medical device technologies, medical data processing and management, medicalpattern recognition, medical biometric systems and applications to be held inshenzhen, between 30th may and 1th june 20xx.
we would like to invite you to submit a manuscript to the internationalconference on medical imaging devices, medical information retrieval, biometrictechnologies, feature matching and classification, computer-aided diagnosis andother applications. the idea is to present originally contributed research,review, and short communication articles in the field of medical biometrics.deadline for submissions would be april 3, 20xx. kindly submit your manuscriptsas an e-mail attachment at luguangm@hit.edu.cn.
i will be looking forward to your favorable reply.
sincerely yours,
guangming lu
20xx-01-02
英文学术会议邀请函 篇3
Dear Ms Wang:
I have the great pleasure, on behalf of the International Conference on Medical Biometrics organization, of inviting you to contribute to the symposium on Medical device technologies, Medical data processing and management, Medical Pattern Recognition, Medical biometric systems and applications to be held in Shenzhen, between 30th May and 1th June 20xx.
We would like to invite you to submit a manuscript to the International Conference on Medical imaging devices, Medical information retrieval, Biometric technologies, Feature matching and classification, Computer-aided diagnosis and Other applications. The idea is to present originally contributed research, review, and short communication articles in the field of Medical Biometrics. Deadline for submissions would be April 3, 20xx. Kindly submit your manuscripts as an E-mail attachment at luguangm@hit.edu.cn.写作模板
I will be looking forward to your favorable reply.
Sincerely yours,
Guangming Lu
20xx-01-02
英文学术会议邀请函 篇4
Dear Sir/Madam:
As one of the oldest disciplines, history had undergone a tremendous transition during the last century, resulting in a blending boom of traditional subjects and countless new perspectives. The beginning of a new century urges the new generation of history scholars to optimize the traditional methods, fields, perspectives and materials of history. Contributing as a leading role, Tsinghua University’s Department of History had witnessed the establishment of major milestones of history in the last century. Since 20xx, we have successfully held two international conferences on history. While the 100th anniversary of Tsinghua opens a new page for the university, the Department of History hereby announces the open of The Third International Academic Conference on History from November 23rd to 24th in 20xx, themed “The Reflection and Outlook of History”. Young scholars from all over the world are warmly welcomed to participate,to share and to progress together.
This conference mainly focuses on doctoral studies. Outstanding works by postgraduate and undergraduate students are also welcomed. Papers that represent any scientific endeavor that addresses itself to any history related issues are welcomed. An abstract less than 1,000 words together with a brief introduction less than 300 words of the author shall be received by June 1st, 20xx via email to: thuhistory@163.com. Results of the review process will be notified by June 20th, 20xx at the latest. Paper invitation will be sent to accepted speakers subsequently. In addition, all presented papers will be included by CNKI. Full papers of no more than 20,000 words must be submitted by September 30th, 20xx. The intention is to publish a collected edition of papers from the event. The conference will take place in Tsinghua University, Beijing and free accommodation will be provided for the participants who come to Beijing from other cities and areas. Travel funding may not be available to postgraduate students and early career scholars.
Contacts:
Bin WANG, binbinwXX88@XX6.com, +86189110286XX
Chengzhong ZHANG, zhangchengzhong20xx@XX6.com, +86158014358XX
Bingwen WANG, wangbingwen20xx@163.com, +86155100866XX
February 7, 20xx
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